Professor J.K. Spelt
BASc MASc, Mechanical Engineer (Cal Tech), PhD PEng
Areas of Research
Mechanics of materials and manufacturing processes
Current and recent projects include:
Microelectronics Packaging
- the dependence of solder creep on state of stress, load and temperature
- solder joint strength prediction
- thermal fatigue models of plated-through-vias (PTVs) in printed circuit boards and measurements of thermal fatigue life using air cycling and IST tests
- accelerated thermal fatigue testing and modeling of microelectronic solder joints
- mechanics of printed circuit board wave soldering and resulting board warpage
Tribology
- abrasive wear and impact erosion associated with the vibratory finishing process
- abrasive jet micro-machining of glass, silicon and polymers for microfluidic and opto-electronic applications
Adhesive Bonding
- automotive structural adhesive bonding including fracture mechanics, fatigue, durability, and the failure of adhesive joints accompanied by large-scale adherend yielding
Wood-based Materials
- analysis of metal-plate wood truss connections
