Campbell, M.I., Amon, C.H, and Cagan, J., "Optimal Three-Dimensional Placement of Heat Generating Electronic Components"

ABSTRACT

This work introduces an algorithm that uses simulated annealing to perform electronic component layout while incorporating constraints related to thermal performance. A hierarchical heat transfer analysis is developed which is used in conjunction with the simulated annealing algorithm to produce final layout configurations that are densely packed and operate within specified temperature ranges. Examples of three-dimensional component placement test cases are presented including an application to embedded wearable computers.