EDITORSHIP & CONFERENCES

IEEE Transactions on Components and Packaging Technologies

The IEEE CPMT TRANSACTIONS - PART A on Components and Packaging

Technologies has focus on the modeling, building blocks, technical infrastructure, and analysis

underpinning electronic and photonic packaging, in addition to new developments in passive

components, electrical contacts and connectors, thermal management, and device reliability.

Editor: Avram Bar-Cohen

Associate Editors: Cristina H. Amon, et al.

Tables of Contents of Past Issues || Latest Issue

ASME Journal of Heat Transfer

Purpose and Scope: The ASME Journal of Heat Transfer disseminates information of

permanent interest in the area of heat tranfer. Contributions to the journal consist of

research on energy transfer in equipment and applied thermodynamic processes in all

fields of mechanical engineering and related industries.

Senior Technical Editor: Professor Vijay Dhir, UCLA, 420 Westwood Plaza Engineering IV,

RM 46-127M, Los Angeles, CA 90095-4026

Associate Editors: Cristina H. Amon, et al.

Heat and Mass Transfer (Wärme- und Stoffubertragüng)

Aims and Scope: Serves the circulation of new developments in the field of basic research

of heat and mass transfer phenomena, as well as related material properties and their measurements.

Editor-in-Chief: Prof. D. Mewes, Institut für Verfahrenstechnik, Universität Hannover,

Callinstraße 36 D-30167 Hannover, Germany

Editorial Board:

* Prof. C. H. Amon, Department of Mechanical Engineering, Carnegie Mellon University,

Pittsburgh, PA 15213-3890, USA

* Prof. M. F. Edwards, Unilever Research, Port Sunlight Laboratory,

Bebington, Wirral Merscyside L63 3JW, UK

* Prof. Y. Kubita, Department of Energy Engineering and Science, Nagoya University Furo-cho,

Chikusa-ku, Nagoya, 464-01, Japan

Current Contents

Conferences

7th International Conference on Modeling in Medicine and Biology, Biomed 2007, The New Forest,
UK, September 10-12, 2007.
Scientific Advisory Committee
THERMES 2007, Thermal Challenges in Next Generation Electronic Systems, Santa Fe, NM,
January 7-10, 2007.
Scientific Committee
17th Int. Symposium on Transport Phenomena, Toyama, Japan, September 19-21, 2006.
International Organizing Committee
AAAS Annual Meeting, St. Louis, MO, February 10, 2006.
Symposium Co-Organizer, Future Nano-Enabled Energy Technologies
ASME IMECE 2005, Orlando, FL, November 11-15, 2005.
Symposium Co-Organizer, Mircro- and Nano-scale Heat Transfer
ASME Summer Heat Transfer Conference, San Francisco, CA, July 18, 2005.
Symposium Organizer in Honor of Bora Mikic

6th Int. Conference on Modeling in Medicine and Biology, Bologna, Italy, September 7-9, 2005.
Scientific Advisory Committee

ASME Heat Transfer 2005 Conference, San Francisco, CA, July 2005.
Technical Program Chair

IMECE 2004 ASME International Mechanical Engineering Congress and Exposition, Anaheim, CA, November 2004.
EPPD Symposium Chair, Micro and Nano Scale Heat Transfer

ITSS 2004
ASME-ZSIS International Thermal Sciences Seminar, ITSS 2004,Bled, Slovenia, June 2004.
Conference Co-Chair

IEEE/ASME ITherm 2004, Las Vegas, NV, June 2004.
Executive Committee Member and Past Chair

IMECE 2003 ASME International Mechanical Engineering Congress and Exposition, Washington, D.C. November 2003.
Symposium Chair and Session Organizer, Micro-and Nano-scale Heat Transfer in Electronics

ASME InterPACK 2003 The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 2003.
Track Chair, Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics

IEEE/ASME ITherm 2002.
The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena
in Electronic Systems, San Diego, California, May 2002.
General Chair

IMECE 2002 ASME International Mechanical Engineering Congress and Exposition
November 2002, New Orleans
Sessions: Micro and Nano Scale Heat Transfer in Electronics